auk corp. SA2336-E the contents of this data sheet are subject to chan ge without advance notice for the purpose of improv ement. when using this product, would you please refer to the latest specifications. rev.odate:08-aug-11 auk-ldm-001(a) 1. features colorless transparency lens type using a package with high heat dissipation properti es, it can be driven with a large current wide viewing angle encapsulating resin : silicone resin external dimensions : 3.5(l)2.8(w)1.9mm(t) surfac e mount type 2. applications backlighting signal indicator symbol backlighting front panel indicator 3. outline dimensions unit : mm 1 . 6 0 0 . 1 3 . 2 0 0 . 0 5 2 . 4 0 0 . 1 1 . 5 0 0 . 1 2 0.80 0.1 0.30 0.1 1 . 0 0 0 . 1 1 2.20 0.05 2.80 0.05 1.90 0.05 0.80 0.05 0 . 7 5 0 . 1 3 . 5 0 . 1 recommended soldering pattern pin connections 1. anode 2. cathode
auk corp. SA2336-E the contents of this data sheet are subject to chan ge without advance notice for the purpose of improv ement. when using this product, would you please refer to the latest specifications. rev.odate:08-aug-11 auk-ldm-001(a) 4. absolute maximum ratings (ta=25 o c) characteristic symbol rating unit power dissipation p d 70 mw forward current i f 30 ma *1 peak forward current i fp 50 ma reverse voltage v r 5 v operating temperature range t opr -40 100 storage temperature range t stg -40 110 *2 soldering temperature t sol 240 for 10 seconds *1.duty ratio = 1/16, pulse width = 0.1ms *2.recommended reflow soldering temperature profile - preheating 150 to 185 within 120 seconds soldering 240 within 10 seconds gradual cooling (avoid quenching) max. 10sec temp ( ) time (sec) 185 150 240 peak temp max. 240 preheating area 150~185 , 9030sec max. 3 /sec 25 time from 25 to peak temperature max. 6min solder area 220 , max. 60sec max. 4 /sec max. -6 /sec 240 180 150 60 0
auk corp. SA2336-E the contents of this data sheet are subject to chan ge without advance notice for the purpose of improv ement. when using this product, would you please refer to the latest specifications. rev.odate:08-aug-11 auk-ldm-001(a) 5. electrical / optical characteristics (ta=25 o c) characteristic symbol test condition min typ max unit forward voltage v f i f = 20ma 1.85 - 2.3 v *3 luminous intensity i v i f = 20ma 120 - 250 mcd dominant wavelength d i f = 20ma 615 621 628 nm spectrum bandwidth ? i f = 20ma - 17 - nm reverse current i r v r =5v - - 10 a *4 half angle /2 i f = 20ma - 60 - deg *3.the test result of i f =20ma is only for reference *4. /2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity v f / i v / d grade classification (ta=25 ) test condition @ i f =20ma forward voltage [v] luminous intensity [mcd] dominant wavelangth [nm] 1 : 1.85~2.1 l : 120~175 a : 615~621 2 : 2.1~2.3 m : 175~250 b : 621~628 (each v f , i v , d range did not consider a margin. please refer to 0.1v of v f range, 18% of i v range, 1nm of d range as a permitted limit and do not use to combin e grade classification. it must be used separately g rade classification)
auk corp. SA2336-E the contents of this data sheet are subject to chan ge without advance notice for the purpose of improv ement. when using this product, would you please refer to the latest specifications. rev.odate:08-aug-11 auk-ldm-001(a) ' precaution for handling silicone resin led ? the encapsulated resin of the leds is silicone. so leds have a soft surface on the top of the package. the pressure to the top surface will be influence to th e reliability of the leds. precaution should be tak en to avoid the strong pressure on the encapsulated part. ? housings using a silicone resin attract dust more c ompared to standard encapsulation. it is recommended that a suitable cleaning solution must be applied to the surface after soldering. 1. handling indications 1) when users handle the smt leds, mechanical stres s on the surface should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. 2) led should only be handled from the side. silic one resin is softer than generally used epoxy resin . 3) when users operate the chip lifter, the picking up nozzle which does not affect the soft surface sh ould be used. this is assured by choosing the picking up nozzle w hich is larger than the led reflecting area. 2. cleaning indication 1) it is strongly recommended that isopropyl alcoho l be used as a solvent. when using other solvents, it should be confirmed beforehand whether the solvents will diss olve the package and the resin or not. freon solven ts should not be used to clean the leds because of worldwide regulations. 2) do not clean the leds by the ultrasonic. when it is absolutely necessary, the influence of ultrason ic cleaning on the leds depends on factors such as ultrasonic powe r and the assembled condition. before cleaning, a pre- test should be done to conf irm whether any damage to the leds will occur.
auk corp. SA2336-E the contents of this data sheet are subject to chan ge without advance notice for the purpose of improv ement. when using this product, would you please refer to the latest specifications. rev.odate:08-aug-11 auk-ldm-001(a) 6. characteristic diagrams fig.4 spectrum distribution i f =20ma fig. 3 i f ? ta fig. 1 i f - v f forward current i f [ma] relative intensity [%] forward voltage v f [v] forward current i f [ma] forward current i f [ma] luminous intensity i v [mcd] fig. 5 radiation diagram 100 50 50 0 100 relative luminous intensity iv [%] ambient temperature ta [ ] wavelength [nm] fig. 2 i v - i f
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